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April 2, 2014
13:32 EDTZIGOZygo unit receives $3M plus order from Asian IC substrate manufacturer
Zygo announced that its Semiconductor Advanced Packaging Systems group has been awarded an order valued in excess of $3M from a major Asian IC substrate manufacturer to deliver multiple state-of-the-art High Volume Manufacturing 3D/2D metrology systems for production process monitoring and product yield enhancement. These latest-generation metrology systems will be assembled and shipped from Zygo's Tainan, Taiwan plant and operations center.
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