|
|
News Breaks
|
February 18, 2010
|
| 16:20 EDT |  | TSRA |
| theflyonthewall.com: | Tessera and Nanium sign packaging technology licensing agreement | | Tessera Technologies announced that its semiconductor packaging subsidiary, Tessera, has signed a technology licensing agreement with Nanium, S.A., formerly known as Qimonda Portugal. Nanium has now reorganized as an independent company and will focus on providing assembly and test services for the DRAM memory market and other semiconductor products. Products manufactured by Nanium will be incorporated into computers, servers and various electronic devices such as MP3 players, mobile phones, photographic cameras and game consoles. The initial term of the license agreement runs through the end of 2017. Under the agreement, Nanium has licensed Tessera's semiconductor packaging technology covering a broad range of chip scale, multi chip and flip chip package types. :theflyonthewall.com |
|
|
News For TSRA From The Last 14 Days Check below for free stories on TSRA the last two weeks.
| Sign up for a free trial to see the rest of the stories you've been missing. |
There are no results for these search parameters.
|
|
|
|
