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Stock Market & Financial Investment News

News Breaks
July 30, 2014
16:35 EDTTSRA, MUTessera, Micron enter new technology and patent license agreements
Tessera Technologies (TSRA) and Micron Technology (MU) announced the execution of new, multiyear technology and patent license agreements. In addition to the new patent license agreement, Tessera’s wholly-owned subsidiary Invensas Corporation will license its Multi-Die Face-Down, or xFDTM, semiconductor packaging technology to Micron and cooperate with Micron on the manufacturing of Micron products that incorporate xFD technology. As part of the agreements, Tessera and Micron will also explore other possible joint development efforts. The specific terms and conditions of the agreements are confidential and have not been disclosed by the companies.
News For TSRA;MU From The Last 14 Days
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April 19, 2015
14:07 EDTMUMicron looks attractive at $28, Barron's says
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April 15, 2015
17:36 EDTMUMicron shares trade lower by 1% after SanDisk Q1 results
15:05 EDTMUEarnings Watch: SanDisk to report Q1 results after lowering revenue guidance
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April 14, 2015
09:19 EDTMUMicron management to meet with Brean Capital
Meeting to be held in Chicago on April 21 hosted by Brean Capital.
April 9, 2015
10:32 EDTMUOptions with decreasing implied volatility
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April 8, 2015
11:22 EDTMUOptions with decreasing implied volatility
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11:07 EDTMUOptions with decreasing implied volatility
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April 7, 2015
11:09 EDTMUOptions with decreasing implied volatility
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09:05 EDTMUMicron management to meet with Oppenheimer
Meeting to be held in Texas on April 13 hosted by Oppenheimer.
05:59 EDTMUMicron implied volatility of 23 at lower end of index mean range
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April 6, 2015
13:35 EDTMUSanDisk climbs after being identified as 'excellent' takeover target
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