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Stock Market & Financial Investment News

News Breaks
June 4, 2014
06:29 EDTTSM, MUTSMC may partner with Micron to develop 3D ICs, DigiTimes reports
Taiwan Semiconductor Manufacturing Company (TSM) is planning to team up with Micron (MU) to develop 3D ICs that would integrate Micron's hybrid DRAM chips with TSMC's logic chips, reports DigiTimes. According to industry sources, a successful development of the technology would enable TSMC to extend it to integrate mobile application processors and DRAM chips. Reference Link
News For TSM;MU From The Last 14 Days
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August 30, 2014
10:08 EDTMURF Micro Devices, Micron better play on Apple suppliers, Barron's says
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August 29, 2014
08:24 EDTMUMicron should be bought at current levels, says Jefferies
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August 28, 2014
07:15 EDTMUMicron, Hynix to respond to Samsung DRAM capacity ramp, DigiTimes says
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August 25, 2014
06:28 EDTTSMTSMC slated to commence 16nm volume production in 1Q15, DigiTimes reports
TSMC (TSM) is expected to start volume production of its 16nm process in 1Q15, DigiTimes reports, citing the Chinese-language Economic Daily News. The company sees monthly output of 50,000 wafers to meet demand for Apple's (AAPL) A9 processors, the report says. Reference Link
August 21, 2014
10:17 EDTMUStocks with call strike movement; MU HTZ
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10:11 EDTTSMTaiwan expects to sell 177M shares of TSMC, Reuters reports
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06:12 EDTMUDRAM prices making downward correction with oversupply concerns, DigiTimes says
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