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December 17, 2013
06:40 EDTSPIL, TSM, AMKR, ASXTSMC adjusts capacity to satisfy rising orders for services, DigiTimes says
TSMC (TSM) sees its in-house capacity for wafer bumping services will fail to meet customer demand and plans to outsource more orders for wafers for use in the manufacture of graphic chips and power management ICs, according to DigiTimes, citing industry sources. The sources disclosed that the company plans to outsource wafer bumping production to backend partners such as Advanced Semiconductor (ASX), Amkor Technology (AMKR) and Siliconware Precision (SPIL). Reference Link
News For TSM;ASX;AMKR;SPIL From The Last 14 Days
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April 17, 2014
12:01 EDTTSMTSMC climbs after profit beats expectations
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11:39 EDTTSMTSMC upgraded to Buy from Neutral at UBS
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06:45 EDTTSMTSMC foresees sales exceeding projections on mobile demand, Bloomberg says
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April 8, 2014
05:35 EDTASXAdvanced Semiconductor reports March revenue up 13.4% to $656M
April 7, 2014
06:20 EDTTSMReport: TSMC Solar to triple CIGS-thin PV module capacity, DigiTimes says
TSMC Solar will expand its annual production capacity to 120MWp from 40MWp in Q3, reports DigiTimes. Citing a Chinese-language Economic Daily News report, TSMS is currently at full capacity. Reference Link

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