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February 20, 2014
05:46 EDTSMISemiconductor Manufacturing, JCET establish JV in China
Semiconductor Manufacturing International and Jiangsu Changjiang Electronics Technology Co., jointly announced today a joint venture for 12" bumping and related testing. JCET will also build advanced back-end package production lines nearby. The two parties will use this as a base to jointly set up and develop an IC manufacturing supply chain within China to provide a high-quality, efficient and convenient one-stop-shop service for global customers focusing on the China market. Bumping is a necessity for wafer yield testing of advanced front-end IC manufacturing technologies, and the basis for the 3D wafer level packaging technology development. With the rapid growth of mobile market in China, and increasing adoption of advanced 40nm and 28nm process technologies, IC chips and their demand for bumping are anticipated to grow rapidly in the next few years
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