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February 20, 2014
05:46 EDTSMISemiconductor Manufacturing, JCET establish JV in China
Semiconductor Manufacturing International and Jiangsu Changjiang Electronics Technology Co., jointly announced today a joint venture for 12" bumping and related testing. JCET will also build advanced back-end package production lines nearby. The two parties will use this as a base to jointly set up and develop an IC manufacturing supply chain within China to provide a high-quality, efficient and convenient one-stop-shop service for global customers focusing on the China market. Bumping is a necessity for wafer yield testing of advanced front-end IC manufacturing technologies, and the basis for the 3D wafer level packaging technology development. With the rapid growth of mobile market in China, and increasing adoption of advanced 40nm and 28nm process technologies, IC chips and their demand for bumping are anticipated to grow rapidly in the next few years
News For SMI From The Last 14 Days
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June 23, 2015
17:21 EDTSMISemiconductor Manufacturing, Qualcomm form joint venture to focus on 14nm tech
Earlier on Tuesday, Semiconductor Manufacturing International (SMI), Huawei, imec, and Qualcomm Global Trading -- an affiliate of Qualcomm (QCOM) -- announced the formation of SMIC Advanced Technology Research & Development, an equity joint venture company. The joint venture company will focus on R&D towards next generation CMOS logic technology and an advanced integrated circuit development R&D platform. SMIC Advanced Technology R&D will be majority owned by SMIC, while Huawei, imec, and Qualcomm will be minority shareholders. "By enabling fabless semiconductor companies to join the development process as shareholders, the product development cycle can be shortened and the advanced process node tape out time can be accelerated," said the statement. In the first phase, the joint venture will develop 14 nanometer CMOS technology for mass production, which will be based on imec's expertise. The project will be done at SMIC's production line. SMIC will have the rights to license the required intellectual property rights on the mass production technologies of advanced nodes developed by the joint venture company.

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