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December 18, 2012
16:42 EDTRBCNRubicon ultra-flat, high-throughput patent allowed by USPTO
Rubicon Technology announced that the United States Patent and Trademark Office has allowed Rubicon's patent application entitled, "Ultra-Flat, High-Throughput Wafer Lapping Process." The patent covers Rubicon's process developed to perform grinding and polishing to achieve consistent, ultra-flat and defect-free surface quality for the high-volume production of large diameter sapphire wafers.
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