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Stock Market & Financial Investment News

News Breaks
June 23, 2014
13:01 EDTINTC, MUMicron announces collaboration with Intel
Micron Technology (MU) announced an ongoing collaboration with Intel (INTC) to deliver an on-package memory solution for Intel's next-generation Xeon Phi processor, codenamed Knights Landing. The memory solution is the result of a long-term effort between the two companies to break down the memory wall, leveraging the fundamental DRAM and stacking technologies also found in Micron's Hybrid Memory Cube products.
News For MU;INTC From The Last 14 Days
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December 18, 2014
10:01 EDTINTCOn The Fly: Analyst Initiation Summary
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06:16 EDTINTCIntel initiated with a Neutral at Citigroup
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December 17, 2014
08:55 EDTINTCJD.com signs partnership pact with Intel on shopping tech, Marbridge Daily says
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December 16, 2014
11:31 EDTINTCRackspace looks to reduce reliance on Intel chips, Bloomberg says
Rackspace Hosting (RAX), which has been testing server computers based on IBM (IBM) Power chip designs, is looking to reduce its reliance on Intel (INTC) chips as it shifting to some server computers based on modified International Business Machine processors, says Bloomberg. Reference Link
December 12, 2014
06:13 EDTMUMicron in talks to revise supply agreement with Inotera, DigiTimes reports
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December 9, 2014
06:25 EDTMUMicron attempt to renegotiate supply agreement with Inotera, DigiTimes says
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December 8, 2014
07:36 EDTMUMicron December volatility of 31 at low end of historic range
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December 5, 2014
13:55 EDTMUMicron CEO said to be upbeat on DRAM pricing, CNBC's Lee reports
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06:21 EDTMUDRAMeXchange: DRAM spot prices hit 7-month low, DigiTimes says
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06:00 EDTMUMicron management to meet with Wedbush
Meeting to be held in New York on December 8 hosted by Wedbush.
December 4, 2014
06:38 EDTINTCIntel to spend $1.6B to upgrade China factory, Reuters says
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06:25 EDTMUPowertech Technology and Micron announce agreement for services in China
Powertech Technology and Micron Technology announced that they have entered into a series of agreements forming the basis of a long-term strategic relationship for assembly and packaging services in Xi'an, China. Under the agreements, Micron will complement its existing test and module manufacturing operations in the Xi'an High Tech Zone through the construction of a new assembly and packaging facility. Upon its completion, PTI will occupy the assembly facility and provide Micron with assembly and packaging services for a period of several years. Reference Link

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