Lam Research unveils 3D NAND, atomic-scale processing products Lam Research last night unveiled its latest thin film deposition and plasma etch products for 3D NAND fabrication. Lam's new systems address needs for three of the most critical steps in forming 3D NAND memory cells, namely stack deposition, vertical channel etching, and tungsten wordline deposition, the company said. Lam also announced the addition of atomic layer etch to its portfolio of atomic layer deposition products and released two new products that "deliver the stringent process control and productivity needed for advanced patterning."
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