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Stock Market & Financial Investment News

News Breaks
March 13, 2014
07:32 EDTINTC, ASML, AMAT, TSMIntel, others pull back on investments for larger silicon wafers, WSJ says
Some computer-chip makers, including Intel (INTC), are concerned about the cost to shift to fabricating chips on larger silicon wafers and appear to have been reining in their investments, reported The Wall Street Journal. ASML Holding (ASML) recently said it had "paused" development of gear designed to work with the larger wafers and the CEO of Applied Materials (AMAT) stated that the move to bigger wafers "has definitely been pushed out from a timing standpoint," the report noted. An industry consortium whose participants include Intel, Taiwan Semi (TSM), Samsung (SSNLF), IBM (IBM) and Globalfoundries held a gathering Wednesday to discuss the status of the new technology, the WSJ added. Reference Link
News For INTC;ASML;AMAT;TSM From The Last 14 Days
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July 15, 2014
07:29 EDTASML, TSMASML Q2 results could miss expectations, says RBC Capital
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07:23 EDTINTCFortune to hold a conference
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July 14, 2014
16:41 EDTINTCIntel initiated with an Outperform at Imperial Capital
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13:02 EDTINTCIntel technical comments ahead of earnings
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09:14 EDTINTCSemiconductor top picks at Topeka
Topeka's anticipates strong unit growth in the smartphone, tablet and wearable end markets and recommends exposure to large/mid cap growth names Intel (INTC), Skyworks (SWKS), Atmel and (ATML), small cap growth name, Rambus (RMBS), and value names Freescale (FSL), Spansion (CODE) and Silicon Motion (SIMO).
09:07 EDTINTCMellanox Q3 guidance likely to be conservative, says Janney Capital
Janney Capital said it expects Mellanox' (MLNX) Q2 revenue to be in-line and for its Q3 guidance to be conservative, as the firm believes the High Performance Computing market has temporarily slowed ahead of Intel's (INTC) release of its Grantley processors. However, the firm thinks that HPC will recover soon and it maintains its Buy rating and $57 fair value estimate on Mellanox.
08:52 EDTINTCIntel volatility increases into Q2 and outlook
Intel July call option implied volatility is at 27, August is at 20, October is at 18; compared to its 26-week average of 19 according to Track Data, suggesting non-directional price movement into the expected release of Q2 on July 15.
08:34 EDTINTCPC market stability could be short-lived, Reuters says
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July 12, 2014
18:33 EDTINTCIntel looks to Chinese unbranded makers to boost tablet presence, WSJ says
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July 11, 2014
06:06 EDTINTCIntel to unveil 14nm processors, 10nm wafers at IDF in September, DigiTimes says
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July 10, 2014
07:54 EDTTSMTSMC begins shipping microprocessors to Apple, WSJ reports
TSMC (TSM) has begun shipping microprocessors to Apple (AAPL) for use in smartphones and tablets, reports the Wall Street Journal. According to people familiar with the matter, TSMC began shipping the microprocessors in Q2 and agreed to work together on more advanced chips next year. Reference Link
July 9, 2014
10:20 EDTINTCReport says Intel delaying Broadwell chip shipment, MacRumors says
Intel (INTC) has decided to further postpone the shipping of its line of 14-nanometer Broadwell chips, which are anticipated to be included in future versions of the Apple's (AAPL) MacBook Air, Retina MacBook Pro, and iMac, according to MacRumors, citing a report on Chinese site VR Zone. Reference Link
07:40 EDTASMLCLSA to hold investor meetings at SEMICON West
Investor Meetings, in conjunction with SEMICON West, will be held in San Francisco on July 9.
06:34 EDTINTCFake document hits federal court in hiring case against tech giants, WSJ says
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06:15 EDTTSMTSMC to speed up development of 19nm process, DigiTimes reports
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July 8, 2014
07:35 EDTASMLUBS to hold meetings at SEMICON West
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06:29 EDTINTCSEMI predicts 21% increase in production equipment purchases in 2014, WSJ says
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06:17 EDTINTCAtmel, Broadcom, Intel, Samsung announce collaboration
Atmel (ATML), Broadcom (BRCM), Dell, Intel (INTC), Samsung (SSNLF) and Wind River are joining forces to establish a new industry consortium focused on improving interoperability and defining the connectivity requirements for the billions of devices that will make up the Internet of Things. The Open Interconnect Consortium is focused on defining a common communications framework based on industry standard technologies to wirelessly connect and intelligently manage the flow of information among personal computing and emerging IoT devices, regardless of form factor, operating system or service provider. Member companies will contribute software and engineering resources to the development of a protocol specification, open source implementation, and a certification program, all with a view of accelerating the development of the IoT. The OIC specification will encompass a range of connectivity solutions, utilizing existing and emerging wireless standards and will be designed to be compatible with a variety of operating systems. Additional member companies are expected to join OIC in the coming months.
05:48 EDTAMATApplied Materials assumed with an Overweight at Piper Jaffray
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05:13 EDTAMATApplied Materials, Tokyo Electron to be called Eteris
Applied Materials and Tokyo Electron unveiled the new name and logo of their combined company, Eteris, which will be used once the merger closes. Applied Materials and Tokyo Electron expect the transaction to close in the second half of 2014.
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