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March 4, 2013
06:24 EDTCODE, UMCSpansion, United Microelectronics announce joint licensing agreement
Spansion (CODE) and United Microelectronics Corporation (UMC) announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion proprietary embedded Charge Trap Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.
News For CODE;UMC From The Last 14 Days
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April 29, 2015
07:21 EDTUMCUnited Microelectronics sees Q2 foundry segment wafer shipments to remain flat
Sees Q2 foundry segment ASP to remain flat. Sees Q2 foundry segment profitability gross profit margin to be in mid-20 percentage range. Sees Q2 foundry segment capacity utilization to be approximately 90%. Sees Fy15 CapEx for foundry segment $1.8B. Expects revenue from new business segment to be approximately NT $1.75B and operating loss to be approximately NT $280M.
07:20 EDTUMCUnited Microelectronics expects 12" fab project in Xiamen to be ready by 2Q16
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07:19 EDTUMCUnited Microelectronics sees Q2 wafer shipments to remain at same levels as Q1
07:18 EDTUMCUnited Microelectronics reports Q1 overall capacity utilization remained at 93%
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07:17 EDTUMCUnited Microelectronics reports Q1 EPS 5.1c, one estimate 5c
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