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Stock Market & Financial Investment News

News Breaks
March 4, 2013
06:24 EDTCODE, UMCSpansion, United Microelectronics announce joint licensing agreement
Spansion (CODE) and United Microelectronics Corporation (UMC) announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion proprietary embedded Charge Trap Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.
News For CODE;UMC From The Last 14 Days
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September 19, 2014
14:40 EDTCODEBalyasny Asset reports 5.17% passive stake in Spansion
September 16, 2014
07:02 EDTCODESpansion and Winbond sign licensing agreement
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September 9, 2014
05:32 EDTUMCUnited Microelectronics reports August sales up 3.79% to NT$11.41B
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