News Breaks |
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| March 4, 2013 |
| 06:24 EDT |  | CODE, UMC | Spansion, United Microelectronics announce joint licensing agreement
Spansion (CODE) and United Microelectronics Corporation (UMC) announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion proprietary embedded Charge Trap Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion. |
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News For CODE;UMC From The Last 14 Days Check below for free stories on CODE;UMC the last two weeks. |
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| May 21, 2013 |
| 10:00 EDT |  | CODE | On The Fly: Analyst Upgrade Summary
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| 08:48 EDT | | CODE | Spansion upgraded to Outperform from Sector Perform at Pacific Crest
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| May 20, 2013 |
| 15:39 EDT |  | CODE | Spansion management to meet with Needham
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| May 15, 2013 |
| 06:07 EDT |  | UMC | TSMC, United Microelectronics wafer shipment grows in April, DigiTimes says
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| May 14, 2013 |
| 11:19 EDT | | CODE | Spansion management to meet with Needham
Meetings to be held in Detroit/Kansas City on May 21 hosted by Needham. |
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| May 10, 2013 |
| 05:44 EDT | | UMC | United Microelectronics reports April revenue down 0.84% to NT$10.28M
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