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Stock Market & Financial Investment News

News Breaks
March 4, 2013
06:24 EDTCODE, UMCSpansion, United Microelectronics announce joint licensing agreement
Spansion (CODE) and United Microelectronics Corporation (UMC) announced the joint development of a 40nm process that integrates UMC's 40nm LP logic process with Spansion proprietary embedded Charge Trap Flash memory technology. As part of this non-exclusive agreement, UMC is licensed to manufacture products based on this technology for Spansion.
News For CODE;UMC From The Last 14 Days
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October 1, 2014
07:27 EDTCODEUBM Tech to hold a conference
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September 26, 2014
11:35 EDTCODEMicron advances after results, outlook beat expectations
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September 22, 2014
15:28 EDTUMCUnited Microelectronics management to meet with JPMorgan
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15:27 EDTUMCUnited Microelectronics management to meet with JPMorgan
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06:17 EDTUMCTSMC, UMC increases wafer production capacity in China, DigiTimes reports
TSMC (TSM) and United Microelectronics (UMC) are ramping up wafer production capacity of 8-inch fabs in China, reports DigiTimes, according to industry sources. In response to the rising demand, TSMC plans to ramp up capacity to 110,000 units a month and UMC plans to expand its production capacity to 60,000 units a month. Reference Link
September 19, 2014
14:40 EDTCODEBalyasny Asset reports 5.17% passive stake in Spansion

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