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Stock Market & Financial Investment News

News Breaks
January 17, 2014
07:30 EDTAXP, GE, MS, INTCFutures slightly above fair value
U.S. equity futures are pointing to a slightly higher open as investors digest earnings reports from some of the country’s largest financial corporations. American Express (AXP), General Electric (GE) and Morgan Stanley (MS),reported fourth quarter results, along with tech giant Intel (INTC). Investors will also be watching the day’s economic releases which include data on housing starts, building permits, industrial production and capacity utilization, along with the University of Michigan's consumer confidence index.
News For AXP;GE;MS;INTC From The Last 14 Days
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July 11, 2014
07:34 EDTMSMorgan Stanley July volatility elevated into Q2 and outlook
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07:20 EDTMSBig banks seen losing reserve release cushion, Reuters says
Releasing loan-loss reserves has helped U.S. big banks weather a period of weak loan demand and lower fee income, but Q2 results from the banks may see less benefit from the practice as loss rates and reserves near their lower limits, said Reuters. Publicly traded companies in the space include Bank of America (BAC), Citigroup (C), Goldman Sachs (GS), JPMorgan (JPM), Morgan Stanley (MS), U.S. Bancorp (USB) and Wells Fargo (WFC). Reference Link
06:06 EDTINTCIntel to unveil 14nm processors, 10nm wafers at IDF in September, DigiTimes says
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July 10, 2014
10:05 EDTAXPOn The Fly: Analyst Initiation Summary
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09:20 EDTMSMorgan Stanley, Lazard recommended at Bernstein
Bernstein recommends Morgan Stanley (MS) and Lazard (LAZ) for their exposure to high margin investment banking. The firm also likes Morgan Stanley because of its exposure to wealth management.
08:10 EDTAXPMorgan Stanley's Vintage Values 2015 list selected
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07:29 EDTGEGeneral Electric volatility elevated into Q2 and revenue outlook
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July 9, 2014
17:48 EDTAXPAmerican Express initiated with an Underperform at Macquarie
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10:20 EDTINTCReport says Intel delaying Broadwell chip shipment, MacRumors says
Intel (INTC) has decided to further postpone the shipping of its line of 14-nanometer Broadwell chips, which are anticipated to be included in future versions of the Apple's (AAPL) MacBook Air, Retina MacBook Pro, and iMac, according to MacRumors, citing a report on Chinese site VR Zone. Reference Link
10:02 EDTAXPOn The Fly: Analyst Upgrade Summary
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07:28 EDTAXPAmerican Express upgraded at Guggenheim
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07:06 EDTGEUniversal Stainless & Alloy achieves S-400, S-1000 approvals from GE Aviation
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06:38 EDTAXPAmerican Express upgraded to Buy from Neutral at Guggenheim
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06:34 EDTINTCFake document hits federal court in hiring case against tech giants, WSJ says
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July 8, 2014
17:09 EDTGEGE, Suncor announce new investments in Alberta oil sands
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09:04 EDTGEGE to supply SSE Renewables with wind turbines
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09:02 EDTGEGE EFS, E.ON partner to complete GE-powered wind farm in Texas Panhandle
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06:29 EDTINTCSEMI predicts 21% increase in production equipment purchases in 2014, WSJ says
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06:22 EDTGEBoeing faces risk to long-term credit if Export-Import Bank is closed, WSJ says
According to a new study by S&P, Boeing (BA) could have to double its financial backing to airline and leasing-company clients over the long term if U.S. lawmakers decide to close the Export-Import Bank, the Wall Street Journal reports. S&P says that a significant expansion of its direct loans and guarantees risks harm to Boeing's long-term credit rating. Other manufacturers, like United Technologies (UTX), Caterpillar (CAT) and General Electric (GE), also face risks should the bank be eliminated. Reference Link
06:17 EDTINTCAtmel, Broadcom, Intel, Samsung announce collaboration
Atmel (ATML), Broadcom (BRCM), Dell, Intel (INTC), Samsung (SSNLF) and Wind River are joining forces to establish a new industry consortium focused on improving interoperability and defining the connectivity requirements for the billions of devices that will make up the Internet of Things. The Open Interconnect Consortium is focused on defining a common communications framework based on industry standard technologies to wirelessly connect and intelligently manage the flow of information among personal computing and emerging IoT devices, regardless of form factor, operating system or service provider. Member companies will contribute software and engineering resources to the development of a protocol specification, open source implementation, and a certification program, all with a view of accelerating the development of the IoT. The OIC specification will encompass a range of connectivity solutions, utilizing existing and emerging wireless standards and will be designed to be compatible with a variety of operating systems. Additional member companies are expected to join OIC in the coming months.
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