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News Breaks
May 27, 2014
08:31 EDTAMKRAmkor, Carsem jointly announce settlement
Amkor Technology and Carsem jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor’s MicroLeadFrame patents. The parties have entered into a settlement agreement to end all pending proceedings related to the dispute and Carsem will pay Amkor an agreed sum for such settlement. Under the terms of the agreement, Carsem and Amkor have granted each other non-exclusive licenses to their respective MLF and MLP patents worldwide.
News For AMKR From The Last 14 Days
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December 16, 2014
13:01 EDTAMKRAmkor Technology licenses copper pillar wafer bump technology to GLOBALFOUNDRIES
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December 10, 2014
14:57 EDTAMKRAmkor Technology motion to overturn ruling in Tessera suit denied
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