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June 11, 2014
06:35 EDTAEHRAehr Test Systems receives follow-on orders for FOX capacity additions
Aehr Test Systems has received follow-on orders for increased FOX-15 wafer level burn-in and test system and WaferPak full wafer contactor capacity from a leading communication equipment manufacturer that will increase the manufacturer's burn-in capacity by 250%.
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October 7, 2015
07:32 EDTAEHRAehr Test Systems announces first order for new FOX-XP Wafer Level Test
Aehr Test Systems announced the company has received its first order for its FOX-XP Wafer Level Test and Burn-in System including multiple FOX-XP WaferPak Contactors and application development services. Aehr Test's FOX-XP system is the company's next-generation multi-wafer test solution that is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer form before they are assembled into single or multi-die stacked packages or for non-packaged die sales or applications where known good die is critical. These singulated die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The FOX-XP system utilizes Aehr Test's FOX WaferPak contactor, which provides a cost effective solution for making electrical contact with a full wafer or substrate in a multi-wafer environment. Aehr Test's WaferPak contactors contain up to tens of thousands of probes to contact all devices on wafers and substrates up to 300mm simultaneously. The FOX-XP system is being developed in configurations up to 25 wafers in parallel in a single system to operate within an efficient manufacturing space footprint. Aehr Test estimates the test equipment and consumables for the emerging multi-wafer level test and burn-in market will add $200 million to $300 million to its served available market.

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