New User:

Forgot your password?

Stock Market & Financial Investment News

News Breaks
July 9, 2014
07:27 EDTMTSN, INTT, CCMP, RTEC, MKSI, FORM, NANO, IVAC, COHU, AEHR, CAMT, ACLS, BRKS6th Annual CEO Investor Summit to be held in San Francisco on July 9
This Summit is hosted by management from the participating companies and features small group meetings.
Sign up for a free trial to see the rest of the stories you've been missing.
October 9, 2015
18:01 EDTACLSAxcelis management to meet with Benchmark
Subscribe for More Information
October 7, 2015
07:32 EDTAEHRAehr Test Systems announces first order for new FOX-XP Wafer Level Test
Aehr Test Systems announced the company has received its first order for its FOX-XP Wafer Level Test and Burn-in System including multiple FOX-XP WaferPak Contactors and application development services. Aehr Test's FOX-XP system is the company's next-generation multi-wafer test solution that is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer form before they are assembled into single or multi-die stacked packages or for non-packaged die sales or applications where known good die is critical. These singulated die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The FOX-XP system utilizes Aehr Test's FOX WaferPak contactor, which provides a cost effective solution for making electrical contact with a full wafer or substrate in a multi-wafer environment. Aehr Test's WaferPak contactors contain up to tens of thousands of probes to contact all devices on wafers and substrates up to 300mm simultaneously. The FOX-XP system is being developed in configurations up to 25 wafers in parallel in a single system to operate within an efficient manufacturing space footprint. Aehr Test estimates the test equipment and consumables for the emerging multi-wafer level test and burn-in market will add $200 million to $300 million to its served available market.
October 6, 2015
08:01 EDTACLSAxcelis receives order for Purion XE from major chipmaker
Axcelis Technologie announced that it has received an order for the Purion XE high energy implanter from a major chipmaker in the Asia Pacific Region. The system will be used to support the development of next generation VNAND Flash devices in the chipmaker's premier research center. The system is scheduled to ship in the Q4.
October 1, 2015
07:56 EDTACLSAxcelis management to meet with B. Riley
Meetings to be held in Chicago on October 7 and in San Francisco on October 8 hosted by B. Riley.
September 30, 2015
09:31 EDTCOHUCohu receives multi-order for Eclipse
Subscribe for More Information
07:52 EDTBRKSBrooks Automation announces approval of $50M share repurchase authorization
Subscribe for More Information
September 29, 2015
08:46 EDTACLSAxcelis reaffirms Q3 EPS view 3c-5c, consensus 4c
Company said, "We reiterate Q3 guidance and remain confident that Axcelis will exit 2015 with 17-20% market share of the implant market. We also expect continued market share growth in 2016 as the Purion product family enters volume production at additional memory and non-leading edge logic and foundry fabs."
08:42 EDTACLSAxcelis receives orders for Purion M from three leading chipmakers
Subscribe for More Information
06:32 EDTRTECRudolph Technologies acquires Stella Alliance for undisclosed amount
Subscribe for More Information
06:14 EDTIVACIntevac receives order of a system with ion implantation source technology
Intevac announced the order of a system configured with ion implantation source technology from a Tier 1 solar cell manufacturer. The system is scheduled to ship in the second half of 2016.
September 28, 2015
05:57 EDTCCMPCabot Microelectronics to host conference call
Subscribe for More Information
05:32 EDTCCMPCabot Microelectronics agrees to acquire NexPlanar Corporation
Cabot Microelectronics announced that it has entered into a definitive agreement to acquire NexPlanar Corporation, a privately-held, U.S. based company that specializes in the development, manufacture and sale of advanced CMP pad solutions for the semiconductor industry. Under the acquisition agreement, Cabot Microelectronics will purchase 100% of the stock of NexPlanar for a purchase price of approximately $142M, plus up to an additional $2.3M depending upon treatment of certain unvested stock options held by NexPlanar security holders. At closing, NexPlanar is expected to have approximately $15M of cash and no debt. The company intends to fund the acquisition from its available cash balance. Cabot Microelectronics' acquisition of NexPlanar is directly aligned with its strategy to strengthen and grow its core CMP consumables business, and in particular, CMP pads. NexPlanar has established meaningful supply positions with technology leading customers for advanced technology node applications. The Company expects that NexPlanar's innovative ElementTM thermoset polyurethane CMP pad technology will complement its own EpicTM thermoplastic polyurethane technology. In addition to expanding its pad product portfolio, Cabot Microelectronics anticipates that the acquisition will leverage the company's existing global sales and technology infrastructure, as well as its supply chain capabilities and quality systems. Cabot Microelectronics expects to close the transaction within 30 to 45 days, subject to customary closing conditions and regulatory approvals.

Sign up for a free trial to see the rest of the stories you've been missing.
I agree to the disclaimer & terms of use