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July 9, 2014
07:27 EDTNANO, IVAC, COHU, MTSN, INTT, CCMP, RTEC, MKSI, FORM, BRKS, AEHR, CAMT, ACLS6th Annual CEO Investor Summit to be held in San Francisco on July 9
This Summit is hosted by management from the participating companies and features small group meetings.
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July 27, 2015
10:00 EDTCAMTOn The Fly: Analyst Initiation Summary
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07:40 EDTCAMTCamtek initiated with a Buy at Needham
Target $4.
July 23, 2015
16:36 EDTNANONanometrics sees Q3 adjusted EPS 0c-6c, consensus 9c
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16:34 EDTNANONanometrics reports Q2 adjusted EPS 8c, consensus 8c
Reports Q2 revenue $48.63M, consensus $47.48M.
05:03 EDTCCMPCabot Microelectronics reports preliminary Q3 EPS 39c, consensus 53c
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July 22, 2015
16:35 EDTMKSIMKS Instruments sees positive business environment in Q3
The company said, "“Reports from the recent SEMICON trade show indicate a continued healthy market for semiconductor production equipment to support the technology inflections underway. Our near-term visibility indicates a continued positive business environment in both our semiconductor and other advanced markets for the third quarter."
16:34 EDTMKSIMKS Instruments sees Q3 adjusted EPS 50c-64c, consensus 55c
Sees Q3 revenue $195M-$215M, consensus $203.46M.
16:33 EDTMKSIMKS Instruments reports Q2 adjusted EPS 62c, consensus 61c
Reports Q2 revenue $218M, consensus $210.61M.
July 21, 2015
09:14 EDTFORMFormFactor remains a premium takeover target, says Summit Research
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July 20, 2015
16:08 EDTIVACIntevac announces new Vertex PVD system order
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July 16, 2015
13:11 EDTMTSNSemiconductor equipment stocks fall after Intel cuts CapEx view
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July 15, 2015
15:24 EDTFORMFormFactor weakness presents buyback opportunity, says Summit Research
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07:26 EDTACLS, MKSI, CCMP, BRKSGuerrant Associates & Headgate Partners co-host a summit
7th Annual CEO Investor Summit 2015 is being held in San Francisco on July 15.
July 14, 2015
08:04 EDTNANO, RTECSemiconductor Equipment & Materials International to hold a conference
SemiCon West 2015 is being held in San Francisco on July 14-16.
06:39 EDTRTECRudolph Technologies and Disco announce collaborative partnership
Rudolph Technologies and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leading-edge hardware and software solutions to optimize the wafer saw unit processes. The complete wafer saw solution includes: DISCO’s fully automatic dicing saw for high-throughput, dual-cut processing, DISCO’s ablation laser saw and stealth dicing saw, Rudolph’s NSX inspection system for post-saw inspection, Rudolph’s new Equipment Sentinel fault detection and classification software for real time monitoring and feedback of DISCO’s dicing tools, and Rudolph’s Discover Enterprise yield management software for sophisticated wafer-to-process tool correlations.

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